Characteristic
High resonant frequency wire wound ceramic structure.
Ultra small volume inductor can provide high Q value.
Ultra thin, high current.
Small chip inductors can be used for automatic assembly.
Excellent resistance to mechanical vibration and extrusion.
Error value ± 2%.
The minimum size is 0402.
In terms of function, mechanical structure, electrical performance and safety, the high-frequency chip inductor is superior to the common inductor. With ceramic high-frequency characteristics and precise winding technology, it has complete electrical characteristics, including high-quality factor (q), high current resistance and flat structure, and provides 0402, 0603, 0805, 1008 and 1206 complete dimensions. The accuracy can reach ± 2%, ± 5% and ± 10%.
High resonant frequency wire wound ceramic structure.
Ultra small volume inductor can provide high Q value.
Ultra thin, high current.
Small chip inductors can be used for automatic assembly.
Excellent resistance to mechanical vibration and extrusion.
Error value ± 2%.
The minimum size is 0402.
In terms of function, mechanical structure, electrical performance and safety, the high-frequency chip inductor is superior to the common inductor. With ceramic high-frequency characteristics and precise winding technology, it has complete electrical characteristics, including high-quality factor (q), high current resistance and flat structure, and provides 0402, 0603, 0805, 1008 and 1206 complete dimensions. The accuracy can reach ± 2%, ± 5% and ± 10%.
Mainly used in information, communication and consumer electronic products, such as: mobile phone (CDMA / GSM / PHS), wireless phone (DECT / ct1ct2), remote control device, security system, wireless automatic control, trwll, wireless LAN / mouse / keyboard / headset, VCO, RF module and wireless products, base station, GPS receiver, CATV filter, tuner, set-top box, USB 2.0, IEEE 1394 and so on.
